1. Photovoltaic silicon wafer cutting workshop (high dust scene)
Area monitoring safety laser scanner to monitor the surroundings. When an object or person enters, the laser scanner will detect and control the robot arm to stop working
Application: In the monocrystalline silicon cutting production line, XD-TOF-05D uses high-precision scanning to monitor the distance between the robot arm and the silicon wafer in real time, and uses dust penetration mode to ensure the stability of the laser in a dense dust environment.
Technical points: Dynamically adjust the laser power to penetrate the dust and detect the edge contour of the silicon wafer; static dissipation design to avoid static breakdown; link the robot arm to generate a suspension path to prevent contact damage.
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